Basic Parameters | |
Heating | IR |
Dimension | L475mmx W480mmx H420mm |
Weight | 15kg |
Total weight | About 17 kg, vary with the differen need of the users |
Electrical Parameters | |
Power | 110V AC |
Upper Heating | IR |
Size of Upper heating | 80mm x 80mm |
Consumption of upper heating | 400W |
Bottom Heating | IR |
Size of Bottom heating | 170mm*170mm |
Consumption of Bottom heating | 800W |
General power | 1250W |
Temperature Control | |
Control mode of Upper | Independent temperature control, high-precision closed-loop control, precision ± 0.5% |
Control mode of Bottom | Independent temperature control, high-precision closed-loop control, precision ± 0.5%, NO Alarm |
Rework Function | |
SMD | Suit for welding, remove or repair packaged devices such as BGA,PBGA,CSP,multi-layer substrates, EMI metallic shield product and solder/lead free Reworkwelding |
Size of applicable chips | ≤70mm x70 mm |
Size of applicable PCB | ≤400mm x305mm |